Polyimide Copper Clad Laminate from China
High-temperature polyimide film backed with refined copper foil ≤0.15mm thick, used for flexible PCBs in electronics. Falls under HTS 7410.21.30 as backed copper foil specifically denoted as copper clad laminates with plastic backing. Refined copper per chapter alloy definitions.
Duty Rate — China → United States
38%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include dielectric constant and peel strength test data in documentation to prove laminate construction
• Ensure declaration specifies 'refined copper foil backed with polyimide' to distinguish from bare polyimide film