Having copper on both sides
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0.15 mm: > Backed: > Of refined copper: > Copper clad laminates > Having a base wholly of plastics impregnated glass: > Having copper on both sides
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 7410.21.30.40
FR-4 Copper Clad Laminate Double-Sided
Double-sided copper clad laminate made with FR-4 epoxy resin impregnated glass fiber base, featuring refined copper foil on both sides with thickness not exceeding 0.15 mm. Used primarily as the foundational material for manufacturing multilayer printed circuit boards (PCBs). Falls under HTS 7410.21.3040 due to its plastic-impregnated glass base and copper cladding on both sides.
1.6mm Double-Sided FR4 Copper Clad Laminate
Standard 1.6mm thick double-sided copper clad laminate with FR-4 glass epoxy substrate and 1 oz refined copper foil on both sides (foil thickness 0.035mm <0.15mm). Widely used for prototyping and production PCBs in telecommunications equipment. HTS 7410.21.3040 applies due to plastics-impregnated glass base with copper on both surfaces.
High Tg FR4 Double-Sided Copper Clad Sheet
High glass transition temperature (Tg 170°C+) FR4 double-sided copper clad laminate with refined copper foil on plastics-impregnated glass cloth base, foil thickness not exceeding 0.15mm. Designed for lead-free soldering and high-reliability automotive electronics PCBs. Meets HTS 7410.21.3040 criteria for double-sided copper clad glass-epoxy laminates.
Rogers 4003C Double-Sided Copper Laminate
Rogers 4003C high-frequency double-sided copper clad laminate featuring ceramic-filled plastics-impregnated glass reinforcement with refined copper foil on both sides (≤0.15mm thick). Used in RF/microwave PCBs for wireless communications. Classifies under HTS 7410.21.3040 as copper clad laminate with plastics-impregnated glass base.
2-Layer PCB Copper Clad Laminate Panel
Standard panel-sized (18x24 inch) double-sided copper clad laminate for 2-layer PCB production, featuring 1.6mm FR-4 glass epoxy core with 1oz refined copper on both sides. Essential raw material for electronic assembly. HTS 7410.21.3040 due to double copper cladding on qualifying base material.
Halogen-Free FR4 Double Copper Clad Laminate
Eco-friendly halogen-free FR4 double-sided copper clad laminate with flame-retardant plastics-impregnated glass fabric and refined copper foil both sides (thickness <0.15mm). Meets RoHS requirements for consumer electronics PCBs. Fits HTS 7410.21.3040 specifications perfectly.
Polyimide Glass Double-Sided Copper Clad
High-temperature polyimide resin with glass fabric double-sided copper clad laminate, refined copper foil ≤0.15mm thick on both sides. Used in aerospace and military PCBs requiring 260°C+ performance. HTS 7410.21.3040 classification for plastics-impregnated glass with double copper.
1oz/1oz Double-Sided FR4 Copper Clad Laminate
1oz copper weight per side (35μm total 70μm) double-sided FR4 copper clad laminate with standard glass epoxy base, total foil thickness under 0.15mm. Industry standard for general purpose rigid PCBs. Precisely matches HTS 7410.21.3040 description.
Aluminum-Backed Copper Clad? No - Double Copper FR4
Pure double-sided refined copper clad FR4 laminate (no metal core), plastics-impregnated glass base with 0.5oz copper both sides for high-volume PCB fabrication. Essential electronics industry raw material. HTS 7410.21.3040 due to specific double copper on glass-plastic construction.
CEM-1 Double-Sided Copper Clad Board
Double-sided copper clad laminate using CEM-1 phenolic resin and glass fiber composite base, with refined copper foil laminated on both sides (thickness ≤0.15 mm). Common substrate for single and double-layer PCBs in consumer electronics. Classified under HTS 7410.21.3040 for its double-sided refined copper on plastics-impregnated glass construction.