FR-4 Copper Clad Laminate Double-Sided

Double-sided copper clad laminate made with FR-4 epoxy resin impregnated glass fiber base, featuring refined copper foil on both sides with thickness not exceeding 0.15 mm. Used primarily as the foundational material for manufacturing multilayer printed circuit boards (PCBs). Falls under HTS 7410.21.3040 due to its plastic-impregnated glass base and copper cladding on both sides.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China3%+35.0%38%
🇲🇽Mexico3%+10.0%13%
🇨🇦Canada3%+10.0%13%
🇩🇪Germany3%+10.0%13%
🇯🇵Japan3%+10.0%13%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7410.21.30Same rate: 38%

If copper clad on only one side

Single-sided copper clad laminates on plastics-impregnated glass base are classified separately within the same subheading.

7410.22.00.00Lower: 36.5% vs 38%

If made with copper-zinc base alloys (brasses)

Changes to copper alloy heading when base metal is brass rather than refined copper, per chapter subheading note (a).

3921.90.11.00Higher: 39.2% vs 38%

If imported as finished PCB without exposed copper foil

Completed printed circuit boards shift to plastics chapter based on predominant material and function.

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Import Tips & Compliance

Verify copper thickness excludes backing and does not exceed 0.15 mm; provide lab test reports for customs verification

Include material composition certificates confirming plastics-impregnated glass base and refined copper alloy compliance

Avoid misclassification as single-sided by clearly documenting 'copper on both sides' in invoices and packing lists

Related Products under HTS 7410.21.30.40

1.6mm Double-Sided FR4 Copper Clad Laminate

Standard 1.6mm thick double-sided copper clad laminate with FR-4 glass epoxy substrate and 1 oz refined copper foil on both sides (foil thickness 0.035mm <0.15mm). Widely used for prototyping and production PCBs in telecommunications equipment. HTS 7410.21.3040 applies due to plastics-impregnated glass base with copper on both surfaces.

High Tg FR4 Double-Sided Copper Clad Sheet

High glass transition temperature (Tg 170°C+) FR4 double-sided copper clad laminate with refined copper foil on plastics-impregnated glass cloth base, foil thickness not exceeding 0.15mm. Designed for lead-free soldering and high-reliability automotive electronics PCBs. Meets HTS 7410.21.3040 criteria for double-sided copper clad glass-epoxy laminates.

Rogers 4003C Double-Sided Copper Laminate

Rogers 4003C high-frequency double-sided copper clad laminate featuring ceramic-filled plastics-impregnated glass reinforcement with refined copper foil on both sides (≤0.15mm thick). Used in RF/microwave PCBs for wireless communications. Classifies under HTS 7410.21.3040 as copper clad laminate with plastics-impregnated glass base.

2-Layer PCB Copper Clad Laminate Panel

Standard panel-sized (18x24 inch) double-sided copper clad laminate for 2-layer PCB production, featuring 1.6mm FR-4 glass epoxy core with 1oz refined copper on both sides. Essential raw material for electronic assembly. HTS 7410.21.3040 due to double copper cladding on qualifying base material.

Halogen-Free FR4 Double Copper Clad Laminate

Eco-friendly halogen-free FR4 double-sided copper clad laminate with flame-retardant plastics-impregnated glass fabric and refined copper foil both sides (thickness <0.15mm). Meets RoHS requirements for consumer electronics PCBs. Fits HTS 7410.21.3040 specifications perfectly.

Polyimide Glass Double-Sided Copper Clad

High-temperature polyimide resin with glass fabric double-sided copper clad laminate, refined copper foil ≤0.15mm thick on both sides. Used in aerospace and military PCBs requiring 260°C+ performance. HTS 7410.21.3040 classification for plastics-impregnated glass with double copper.