Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3% | +35.0% | 38% |
| 🇲🇽Mexico | 3% | +10.0% | 13% |
| 🇨🇦Canada | 3% | +10.0% | 13% |
| 🇩🇪Germany | 3% | +10.0% | 13% |
| 🇯🇵Japan | 3% | +10.0% | 13% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If PTFE sheet with surface metallization only
Other plastic sheets/foil if copper not qualifying as full backing per Chapter 74 definitions.
If for alloy copper versions like brass-clad
Copper-zinc brasses per note (a) move to alloy subheading regardless of laminate type.
Not sure which classification is right?
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Import Tips & Compliance
• Provide manufacturer specs confirming refined copper (not alloy) and exact foil thickness measurement method
• Register for low-duty programs if qualifying under trade agreements for electronics materials
Related Products under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Single-Sided Copper Clad Laminate Panel
Large format panels of epoxy laminate with refined copper foil on one side only, thickness ≤0.15mm, cut to size for PCB fabrication. HTS 7410.21.30 explicitly includes these copper clad laminates of refined copper.