Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3% | +75.0% | 78% |
| 🇲🇽Mexico | 3% | +50.0% | 53% |
| 🇨🇦Canada | 3% | +50.0% | 53% |
| 🇩🇪Germany | 3% | +50.0% | 53% |
| 🇯🇵Japan | 3% | +50.0% | 53% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If PTFE sheet with surface metallization only
Other plastic sheets/foil if copper not qualifying as full backing per Chapter 74 definitions.
If for alloy copper versions like brass-clad
Copper-zinc brasses per note (a) move to alloy subheading regardless of laminate type.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide manufacturer specs confirming refined copper (not alloy) and exact foil thickness measurement method
• Register for low-duty programs if qualifying under trade agreements for electronics materials
Related Products under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Single-Sided Copper Clad Laminate Panel
Large format panels of epoxy laminate with refined copper foil on one side only, thickness ≤0.15mm, cut to size for PCB fabrication. HTS 7410.21.30 explicitly includes these copper clad laminates of refined copper.