CEM-1 Copper Clad Board
Copper clad laminate using cost-effective CEM-1 phenolic paper substrate with refined copper foil cladding ≤0.15mm, for single-sided PCBs. HTS 7410.21.30 covers these paper/plastics-backed refined copper foils as copper clad laminates.
Import Duty Rates by Country of Origin
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If paper-based with very thin copper layer
If predominantly paper fluting/weight, may classify as paper articles rather than copper foil laminates.
If pre-drilled or routed to board shape
Machined blanks with conductor paths enter Chapter 85 as printed circuit boards, even if unpopulated.
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Import Tips & Compliance
• Document copper weight (e.g
• 1oz/ft²) and substrate type; customs may test for paper vs. pure plastic backing
• Avoid 'double-sided PCB' labeling; declare as 'unfinished copper clad laminate' to stay in Chapter 74
Related Products under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.