CEM-1 Copper Clad Board from Japan
Copper clad laminate using cost-effective CEM-1 phenolic paper substrate with refined copper foil cladding ≤0.15mm, for single-sided PCBs. HTS 7410.21.30 covers these paper/plastics-backed refined copper foils as copper clad laminates.
Duty Rate — Japan → United States
13%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document copper weight (e.g
• 1oz/ft²) and substrate type; customs may test for paper vs. pure plastic backing
• Avoid 'double-sided PCB' labeling; declare as 'unfinished copper clad laminate' to stay in Chapter 74