FR-4 Copper Clad Laminate Sheet
A rigid laminate sheet made from FR-4 epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, thickness under 0.15 mm excluding backing. Classified under HTS 7410.21.30 as copper foil backed with insulating material forming copper clad laminates for PCB production. Meets chapter definitions for refined copper foil backed with plastics-like substrate.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | 3% | +35.0% | 38% |
| 🇲🇽Mexico | 3% | +10.0% | 13% |
| 🇨🇦Canada | 3% | +10.0% | 13% |
| 🇩🇪Germany | 3% | +10.0% | 13% |
| 🇯🇵Japan | 3% | +10.0% | 13% |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If made from copper alloys like brass or bronze
Copper-zinc or copper-tin alloys per subheading notes shift to copper alloy foil heading, not refined copper.
If pre-patterned or etched with circuitry
Boards with electrical circuitry (even undeveloped) classify in Chapter 85 as insulated metal-core modules, not plain clad laminates.
If primarily fiberglass/epoxy composite with minimal copper
If valued mainly as plastic/fiberglass article rather than copper foil backing, may classify as composite articles of plastics.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Verify copper foil thickness excludes backing and is ≤0.15mm; measure substrate separately to confirm classification
• Provide mill test certificates proving refined copper purity and laminate specs to avoid reclassification as unfinished PCBs
Related Products under HTS 7410.21.30
Aluminum-Backed Copper Clad Laminate
Refined copper foil laminated to thin aluminum substrate for metal-core PCBs in LED lighting, foil ≤0.15mm. Still HTS 7410.21.30 as copper foil backed with metal-like 'similar backing materials' per heading.
Double-Sided 1.6mm FR4 Copper Clad Laminate
Standard 1.6mm thick FR4 laminate with refined copper foil on both sides (total foil <0.15mm), industry workhorse for PCBs. HTS 7410.21.30 for copper clad laminates of refined copper foil.
Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, refined copper foil ≤0.15mm with adhesive backing. Classified HTS 7410.21.30 as backed refined copper clad laminates.
High-Tg FR4 Copper Clad Laminate
FR4 laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15mm. HTS 7410.21.30 applies to all such refined copper clad laminates.
Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15mm thickness. Under HTS 7410.21.30 as plastics/similar backed copper clad laminates.
Rogers RO4000 Series Copper Clad Laminate
High-frequency PTFE-based laminate from Rogers Corporation clad with refined copper foil <0.15mm for RF/microwave PCBs. Specifically classified under HTS 7410.21.30 for refined copper clad laminates with plastics backing.