Boron Carbide Sputtering Target Material
High-density boron carbide material prepared for thin-film deposition via sputtering in semiconductor manufacturing. Classified under HTS 2849.90.10.00 as chemically defined boron carbide in raw target form.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If semiconductor manufacturing materials
Chemical elements prepared for semiconductor fabrication fall under 3818.
If mounted on semiconductor equipment parts
Parts for semiconductor machinery classify under Chapter 84/85.
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Import Tips & Compliance
• Provide sputtering target density (>95% theoretical) and surface finish specifications
• Classify as chemical compound, not finished article, if not mounted on backing plates
• Cleanroom packaging required; contamination voids chemical purity claims
Related Products under HTS 2849.90.10.00
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