2849.90.10.00/Boron Carbide Sputtering Target Material/Japan

Boron Carbide Sputtering Target Material from Japan

High-density boron carbide material prepared for thin-film deposition via sputtering in semiconductor manufacturing. Classified under HTS 2849.90.10.00 as chemically defined boron carbide in raw target form.

Duty Rate — Japan → United States

13.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide sputtering target density (>95% theoretical) and surface finish specifications

• Classify as chemical compound, not finished article, if not mounted on backing plates

• Cleanroom packaging required; contamination voids chemical purity claims

Boron Carbide Sputtering Target Material from Japan — Import Duty Rate | HTS 2849.90.10.00