Boron Carbide Sputtering Target Material from Japan
High-density boron carbide material prepared for thin-film deposition via sputtering in semiconductor manufacturing. Classified under HTS 2849.90.10.00 as chemically defined boron carbide in raw target form.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide sputtering target density (>95% theoretical) and surface finish specifications
• Classify as chemical compound, not finished article, if not mounted on backing plates
• Cleanroom packaging required; contamination voids chemical purity claims