High-Purity Boron Carbide for Nuclear Applications
Ultra-high purity boron carbide specifically for neutron absorption in nuclear reactors. Falls under HTS 2849.90.10.00 as chemically defined boron carbide compound, distinguished by isotopic purity.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If containing radioactive isotopes or elements
Radioactive compounds or isotopes fall under heading 2844 regardless of chemical base.
If for bulk metalworking or alloy production
Boron compounds used as metal additives may classify under Chapter 81 rare earths.
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Import Tips & Compliance
• Obtain end-user certificates due to nuclear applications; may require NRC or DOE authorization
• Specify boron-10 isotope enrichment levels in documentation to prevent reclassification
• Package in sealed containers to maintain purity; contamination leads to 3824 classification
Related Products under HTS 2849.90.10.00
Boron Carbide Powder B4C 99% Purity
High-purity boron carbide (B4C) powder used primarily as an abrasive in polishing and grinding applications. This chemically defined inorganic compound of boron falls under HTS 2849.90.10.00 as a carbide of boron, not further processed into finished articles.
Amorphous Boron Carbide Granules 10-50 Micron
Granular amorphous boron carbide (B4C) used in metallurgical additives and ceramic raw materials. Classified under HTS 2849.90.10.00 as chemically defined boron carbide in granular form, excluding finished products.
Boron Carbide Abrasive Micro-Powder F220
F220 grit boron carbide micro-powder standardized for precision lapping and polishing of semiconductors and optics. Classified as chemically defined boron carbide under HTS 2849.90.10.00 before final abrasive article assembly.
Reaction-Bonded Boron Carbide Precursor Powder
Specialty boron carbide powder designed for reaction-bonded ceramic processing in armor and wear-resistant applications. Remains under HTS 2849.90.10.00 as pure chemical compound prior to sintering.
Boron Carbide Sputtering Target Material
High-density boron carbide material prepared for thin-film deposition via sputtering in semiconductor manufacturing. Classified under HTS 2849.90.10.00 as chemically defined boron carbide in raw target form.
Ultra-Fine Boron Carbide Nanopowder <500nm
Nanoscale boron carbide powder with average particle size <500nm for advanced composites and coatings. Meets HTS 2849.90.10.00 criteria as chemically defined boron carbide nanomaterial.