Pfeiffer Vacuum Cluster Tool PVD
Pfeiffer Vacuum cluster tool physical vapor deposition apparatus integrates multiple PVD process chambers with central handling for compound semiconductor manufacturing. Features cryopump technology for UHV conditions. HTS 8543.70.20.00 specifically for such apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| π¨π³China | 2.5% | +35.0% | 37.5% |
| π²π½Mexico | 2.5% | +10.0% | 12.5% |
| π¨π¦Canada | 2.5% | +10.0% | 12.5% |
| π©πͺGermany | 2.5% | +10.0% | 12.5% |
| π―π΅Japan | 2.5% | +10.0% | 12.5% |
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
β’ Document cryopump specifications and base pressure capabilities
β’ Compound semiconductor use may require ITAR/EAR classification
β’ Provide complete cluster configuration schematic
Related Products under HTS 8543.70.20.00
Kurt J. Lesker PVD 75 Physical Vapor Deposition System
The Kurt J. Lesker PVD 75 is a compact physical vapor deposition apparatus used for thin film deposition via evaporation or sputtering in semiconductor and optics manufacturing. It incorporates vacuum chambers, electron beam sources, and substrate heaters to deposit materials like metals and dielectrics onto substrates. Classified under HTS 8543.70.20.00 as dedicated PVD apparatus for electrical thin film production.
Applied Materials Endura PVD Cluster Tool
The Applied Materials Endura is an advanced cluster tool physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses magnetron sputtering technology in ultra-clean vacuum environments. HTS 8543.70.20.00 specifically covers such dedicated PVD systems for electrical component fabrication.
AJA International Orion Series Sputtering System
AJA Orion 8 is a research-grade physical vapor deposition apparatus specializing in DC/RF magnetron sputtering for thin film deposition on substrates up to 8 inches. Configurable with multiple guns and substrate bias, it's used for R&D in electronics and photonics. Falls under HTS 8543.70.20.00 as specialized PVD apparatus.
Veeco SPECTRO Series PVD System
Veeco SPECTRO physical vapor deposition apparatus uses ion beam sputtering for precision optical coatings and semiconductor films, featuring automated substrate handling and in-situ monitoring. Designed for high-uniformity deposition over large areas. Classified in 8543.70.20.00 for its electrical thin film deposition function.
CHA Industries Mark 50 Evaporation System
CHA Mark 50 is a thermal evaporation physical vapor deposition apparatus with bell jar vacuum system for metallization of semiconductor wafers and MEMS devices. Features resistance and e-beam evaporation sources. HTS 8543.70.20.00 covers dedicated evaporation PVD equipment.
Angstrom Engineering Evovac Deposition System
Angstrom Engineering Evovac is a multi-technique physical vapor deposition apparatus combining thermal evaporation, sputtering, and organic deposition for OLED and organic electronics research. Modular design with glovebox integration capability. Specifically classified under HTS 8543.70.20.00.