Pfeiffer Vacuum Cluster Tool PVD from China
Pfeiffer Vacuum cluster tool physical vapor deposition apparatus integrates multiple PVD process chambers with central handling for compound semiconductor manufacturing. Features cryopump technology for UHV conditions. HTS 8543.70.20.00 specifically for such apparatus.
Duty Rate — China → United States
40%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document cryopump specifications and base pressure capabilities
• Compound semiconductor use may require ITAR/EAR classification
• Provide complete cluster configuration schematic