Physical vapor deposition apparatus
Electrical machines and apparatus, having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and apparatus: > Physical vapor deposition apparatus
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8543.70.20.00
Kurt J. Lesker PVD 75 Physical Vapor Deposition System
The Kurt J. Lesker PVD 75 is a compact physical vapor deposition apparatus used for thin film deposition via evaporation or sputtering in semiconductor and optics manufacturing. It incorporates vacuum chambers, electron beam sources, and substrate heaters to deposit materials like metals and dielectrics onto substrates. Classified under HTS 8543.70.20.00 as dedicated PVD apparatus for electrical thin film production.
Applied Materials Endura PVD Cluster Tool
The Applied Materials Endura is an advanced cluster tool physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses magnetron sputtering technology in ultra-clean vacuum environments. HTS 8543.70.20.00 specifically covers such dedicated PVD systems for electrical component fabrication.
AJA International Orion Series Sputtering System
AJA Orion 8 is a research-grade physical vapor deposition apparatus specializing in DC/RF magnetron sputtering for thin film deposition on substrates up to 8 inches. Configurable with multiple guns and substrate bias, it's used for R&D in electronics and photonics. Falls under HTS 8543.70.20.00 as specialized PVD apparatus.
Veeco SPECTRO Series PVD System
Veeco SPECTRO physical vapor deposition apparatus uses ion beam sputtering for precision optical coatings and semiconductor films, featuring automated substrate handling and in-situ monitoring. Designed for high-uniformity deposition over large areas. Classified in 8543.70.20.00 for its electrical thin film deposition function.
CHA Industries Mark 50 Evaporation System
CHA Mark 50 is a thermal evaporation physical vapor deposition apparatus with bell jar vacuum system for metallization of semiconductor wafers and MEMS devices. Features resistance and e-beam evaporation sources. HTS 8543.70.20.00 covers dedicated evaporation PVD equipment.
Angstrom Engineering Evovac Deposition System
Angstrom Engineering Evovac is a multi-technique physical vapor deposition apparatus combining thermal evaporation, sputtering, and organic deposition for OLED and organic electronics research. Modular design with glovebox integration capability. Specifically classified under HTS 8543.70.20.00.
Denton Vacuum Explorer HP PVD System
Denton Vacuum Explorer High Performance physical vapor deposition apparatus supports sputtering, evaporation, and PECVD for high-throughput coating applications in electronics manufacturing. Features automated load locks and cluster architecture. HTS 8543.70.20.00 for dedicated PVD apparatus.
Leybold L900 Sputtering System
Leybold L900 is an industrial physical vapor deposition apparatus using reactive magnetron sputtering for large-area coatings on architectural glass and web substrates in display manufacturing. High power handling for production-scale deposition. Classified under 8543.70.20.00 for PVD function.
Pfeiffer Vacuum Cluster Tool PVD
Pfeiffer Vacuum cluster tool physical vapor deposition apparatus integrates multiple PVD process chambers with central handling for compound semiconductor manufacturing. Features cryopump technology for UHV conditions. HTS 8543.70.20.00 specifically for such apparatus.
Mustang Vacuum Systems MVP Platform
Mustang Vacuum MVP is a modular physical vapor deposition apparatus platform for custom sputtering and evaporation configurations serving aerospace and defense thin film applications. Scalable from R&D to pilot production. Falls under HTS 8543.70.20.00.
Singulus Technologies PVD Cluster
Singulus PVD cluster systems are physical vapor deposition apparatus for optical data storage media manufacturing, featuring inline sputtering for multilayer reflective coatings. High-precision deposition control for DVD/Blu-ray production. Classified in 8543.70.20.00.
Oerlikon Balzers BAK Series Evaporation
Oerlikon Balzers BAK 1100 physical vapor deposition apparatus uses resistance and electron beam evaporation for decorative and functional coatings on tools and components. Large batch processing capability. HTS 8543.70.20.00 for PVD apparatus.
Telemark E-Beam PVD System
Telemark electron beam physical vapor deposition apparatus specializes in high-melting point material evaporation for optical thin films and wear-resistant coatings. Features multi-pocket e-gun sources. Dedicated PVD classification under 8543.70.20.00.
CVC Z-400 Sputtering System
CVC Z-400 planar magnetron physical vapor deposition apparatus for semiconductor metallization layers, featuring cryogenic pumping and substrate preheat stations. Proven platform for aluminum and titanium deposition. HTS 8543.70.20.00 coverage.
Novellus (Lam Research) SPEED PVD
Novellus SPEED physical vapor deposition apparatus uses ionized metal plasma technology for advanced copper interconnect filling in semiconductor devices. Features collimation and resputtering capabilities. Classified under HTS 8543.70.20.00 for PVD.