Kurt J. Lesker PVD 75 Physical Vapor Deposition System
The Kurt J. Lesker PVD 75 is a compact physical vapor deposition apparatus used for thin film deposition via evaporation or sputtering in semiconductor and optics manufacturing. It incorporates vacuum chambers, electron beam sources, and substrate heaters to deposit materials like metals and dielectrics onto substrates. Classified under HTS 8543.70.20.00 as dedicated PVD apparatus for electrical thin film production.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified as industrial machinery for multiple coating processes
PVD systems with broader industrial applications may fall under other industrial machinery rather than electrical-specific apparatus
If primarily a vacuum coating chamber without dedicated deposition sources
Machinery for treatment of materials using hot gases or vacuum processes covers basic vacuum chambers separately from specialized PVD
If for laboratory research PVD systems under 50L chamber volume
Small-scale PVD equipment for lab analysis falls under laboratory physical/chemical instruments
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Import Tips & Compliance
• Verify apparatus meets PVD definition with vacuum chamber and deposition source; provide technical specs and end-use statement
• Ensure export controls compliance for high-tech vacuum equipment
• Common pitfall: misclassification as general lab equipment
Related Products under HTS 8543.70.20.00
Applied Materials Endura PVD Cluster Tool
The Applied Materials Endura is an advanced cluster tool physical vapor deposition apparatus for high-volume semiconductor manufacturing, featuring multiple process modules for metal and barrier layer deposition. It uses magnetron sputtering technology in ultra-clean vacuum environments. HTS 8543.70.20.00 specifically covers such dedicated PVD systems for electrical component fabrication.
AJA International Orion Series Sputtering System
AJA Orion 8 is a research-grade physical vapor deposition apparatus specializing in DC/RF magnetron sputtering for thin film deposition on substrates up to 8 inches. Configurable with multiple guns and substrate bias, it's used for R&D in electronics and photonics. Falls under HTS 8543.70.20.00 as specialized PVD apparatus.
Veeco SPECTRO Series PVD System
Veeco SPECTRO physical vapor deposition apparatus uses ion beam sputtering for precision optical coatings and semiconductor films, featuring automated substrate handling and in-situ monitoring. Designed for high-uniformity deposition over large areas. Classified in 8543.70.20.00 for its electrical thin film deposition function.
CHA Industries Mark 50 Evaporation System
CHA Mark 50 is a thermal evaporation physical vapor deposition apparatus with bell jar vacuum system for metallization of semiconductor wafers and MEMS devices. Features resistance and e-beam evaporation sources. HTS 8543.70.20.00 covers dedicated evaporation PVD equipment.
Angstrom Engineering Evovac Deposition System
Angstrom Engineering Evovac is a multi-technique physical vapor deposition apparatus combining thermal evaporation, sputtering, and organic deposition for OLED and organic electronics research. Modular design with glovebox integration capability. Specifically classified under HTS 8543.70.20.00.
Denton Vacuum Explorer HP PVD System
Denton Vacuum Explorer High Performance physical vapor deposition apparatus supports sputtering, evaporation, and PECVD for high-throughput coating applications in electronics manufacturing. Features automated load locks and cluster architecture. HTS 8543.70.20.00 for dedicated PVD apparatus.