Kurt J. Lesker PVD 75 Physical Vapor Deposition System from China
The Kurt J. Lesker PVD 75 is a compact physical vapor deposition apparatus used for thin film deposition via evaporation or sputtering in semiconductor and optics manufacturing. It incorporates vacuum chambers, electron beam sources, and substrate heaters to deposit materials like metals and dielectrics onto substrates. Classified under HTS 8543.70.20.00 as dedicated PVD apparatus for electrical thin film production.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify apparatus meets PVD definition with vacuum chamber and deposition source; provide technical specs and end-use statement
• Ensure export controls compliance for high-tech vacuum equipment
• Common pitfall: misclassification as general lab equipment