Flip-Chip CSP LED 3030

Chip-scale package (CSP) 3030 flip-chip LED with direct substrate bonding for maximum light extraction. HTS 8541.41.00.00 includes advanced packaging light-emitting diodes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+25.0%25%
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡¨πŸ‡¦CanadaFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8541.90.00Higher: 50% vs 25%

If bare semiconductor wafers before dicing

Undiced LED wafers classify as parts of semiconductor devices.

8486.90.00.00Same rate: 25%

If semiconductor manufacturing machines containing LEDs

LEDs in semiconductor fab equipment classify with the machinery.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

β€’ Specify phosphor coating type and LES (light emitting surface) size; ensure wire-bond free certification; provide reliability test data (LM79)