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8541.41.00.00/Flip-Chip CSP LED 3030/Mexico

Flip-Chip CSP LED 3030 from Mexico

Chip-scale package (CSP) 3030 flip-chip LED with direct substrate bonding for maximum light extraction. HTS 8541.41.00.00 includes advanced packaging light-emitting diodes.

Duty Rate — Mexico → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Specify phosphor coating type and LES (light emitting surface) size; ensure wire-bond free certification; provide reliability test data (LM79)