8541.41.00.00/Flip-Chip CSP LED 3030/China

Flip-Chip CSP LED 3030 from China

Chip-scale package (CSP) 3030 flip-chip LED with direct substrate bonding for maximum light extraction. HTS 8541.41.00.00 includes advanced packaging light-emitting diodes.

Duty Rate — China → United States

25%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Calculate with your customs value Verify classification with AI

Import Tips

• Specify phosphor coating type and LES (light emitting surface) size; ensure wire-bond free certification; provide reliability test data (LM79)