8541.41.00.00/Flip-Chip CSP LED 3030/Japan

Flip-Chip CSP LED 3030 from Japan

Chip-scale package (CSP) 3030 flip-chip LED with direct substrate bonding for maximum light extraction. HTS 8541.41.00.00 includes advanced packaging light-emitting diodes.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify phosphor coating type and LES (light emitting surface) size; ensure wire-bond free certification; provide reliability test data (LM79)