Flip-Chip CSP LED 3030 from Japan
Chip-scale package (CSP) 3030 flip-chip LED with direct substrate bonding for maximum light extraction. HTS 8541.41.00.00 includes advanced packaging light-emitting diodes.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify phosphor coating type and LES (light emitting surface) size; ensure wire-bond free certification; provide reliability test data (LM79)