Gallium Arsenide RF Transistor Die
Unmounted GaAs chips or dice designed for high-frequency RF transistors used in wireless communication base stations. Falls under HTS 8541.29.00.40 as unmounted transistor dice other than photosensitive. These high-electron-mobility transistor (HEMT) structures are pre-packaging for microwave applications.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If mounted piezo-electric crystals instead of transistors
Heading 8541 covers mounted piezo crystals separately; transistor dice remain unmounted semiconductor devices.
If assembled into other electrical machines as components
Post-assembly into modules shifts to 8543 for other electrical machinery components.
If for semiconductor manufacturing equipment parts, not standalone dice
Dice used in fab tools may classify under semiconductor equipment parts in 8486.
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Import Tips & Compliance
• Declare exact compound semiconductor material (GaAs) and wafer thickness to distinguish from silicon variants
• Obtain export licenses from origin country if dual-use technology; include end-user certificates
Related Products under HTS 8541.29.00.40
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LDMOS RF Power Transistor Wafer
Laterally Diffused Metal Oxide Semiconductor wafer for broadcast transmitters. Unmounted under HTS 8541.29.00.40. High power RF amplification capability.
Silicon Carbide JFET Wafer
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BiCMOS Transistor Wafer
Bipolar CMOS mixed-signal transistor wafer for analog-digital interfaces. Unmounted chips HTS 8541.29.00.40.
SOI MOSFET Transistor Wafer
Silicon-On-Insulator MOSFET wafer for radiation-hardened electronics. HTS 8541.29.00.40 unmounted.