Gallium Arsenide PIN Diode Die
Individual unmounted GaAs PIN diode dice designed for RF switching, attenuation, and microwave applications in telecommunications. These dice feature precise p-i-n junction structures formed on gallium arsenide substrate. HTS 8541.10.0040 applies to such unmounted semiconductor dice for non-photosensitive, non-LED diodes.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If mounted on lead frames or headers
Mounted diode chips or assemblies shift to parts of semiconductor devices under 8541.90
If classified as other electrical machines' parts
Certain diode dice for specific equipment may fall under 8543 for other electrical apparatus parts
If wafer form for waste/scrap processing
Defective or spent wafers might classify under 8548 for electrical machinery waste
Not sure which classification is right?
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Import Tips & Compliance
• Include material safety data sheets confirming non-radioactive GaAs composition to avoid hazmat classification issues
• Declare exact die dimensions and electrical specs; mismatches can lead to reclassification as integrated circuits
• Use anti-static and moisture-barrier packaging; improper handling often results in yield loss claims at import
Related Products under HTS 8541.10.00.40
Automotive Grade Silicon Flyback Diode Wafer
AEC-Q101 qualified 200mm silicon wafers for flyback protection diodes in automotive ignition systems and DC-DC converters. Designed for high surge current and automotive temperature extremes. Unmounted automotive diode wafers under HTS 8541.10.0040.
Silicon Schottky Diode Wafer
A large silicon wafer containing thousands of unmounted Schottky diode chips used in power rectification and high-frequency switching applications. These wafers are produced through semiconductor fabrication processes and diced into individual dice post-import. Classified under HTS 8541.10.0040 as unmounted chips, dice, and wafers specifically for diodes other than photosensitive or LED types.
Silicon Zener Diode Wafer
300mm silicon wafers patterned with Zener diode structures for voltage regulation in power supplies and protection circuits. These unseparated wafers undergo diffusion and metallization processes before dicing. Fits HTS 8541.10.0040 for unmounted diode wafers excluding photosensitive or LED variants.
200mm Silicon Rectifier Diode Wafer
200mm diameter silicon epitaxial wafers for high-voltage rectifier diodes used in automotive alternators and industrial power supplies. Features p-n junction arrays optimized for forward voltage drop and surge current. HTS 8541.10.0040 covers these unmounted diode wafer forms.
Silicon Carbide Power Diode Die
Unmounted SiC Schottky diode dice for high-temperature, high-power applications in EV inverters and renewable energy systems. These 1200V-rated dice offer low switching losses compared to silicon. Classified in HTS 8541.10.0040 as unmounted chips/dice for non-LED diodes.
Germanium Point Contact Diode Chip
Unmounted germanium chips with whisker point-contact diodes for detector applications in microwave receivers and instrumentation. Known for low forward voltage and high-frequency response. HTS 8541.10.0040 includes such legacy semiconductor diode chips.