Unmounted chips, dice and wafers
Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals; parts thereof: > Diodes, other than photosensitive or light-emitting diodes (LED) > Unmounted chips, dice and wafers
Duty Rate (from China)
Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Products classified under HTS 8541.10.00.40
Automotive Grade Silicon Flyback Diode Wafer
AEC-Q101 qualified 200mm silicon wafers for flyback protection diodes in automotive ignition systems and DC-DC converters. Designed for high surge current and automotive temperature extremes. Unmounted automotive diode wafers under HTS 8541.10.0040.
Silicon Schottky Diode Wafer
A large silicon wafer containing thousands of unmounted Schottky diode chips used in power rectification and high-frequency switching applications. These wafers are produced through semiconductor fabrication processes and diced into individual dice post-import. Classified under HTS 8541.10.0040 as unmounted chips, dice, and wafers specifically for diodes other than photosensitive or LED types.
Gallium Arsenide PIN Diode Die
Individual unmounted GaAs PIN diode dice designed for RF switching, attenuation, and microwave applications in telecommunications. These dice feature precise p-i-n junction structures formed on gallium arsenide substrate. HTS 8541.10.0040 applies to such unmounted semiconductor dice for non-photosensitive, non-LED diodes.
Silicon Zener Diode Wafer
300mm silicon wafers patterned with Zener diode structures for voltage regulation in power supplies and protection circuits. These unseparated wafers undergo diffusion and metallization processes before dicing. Fits HTS 8541.10.0040 for unmounted diode wafers excluding photosensitive or LED variants.
200mm Silicon Rectifier Diode Wafer
200mm diameter silicon epitaxial wafers for high-voltage rectifier diodes used in automotive alternators and industrial power supplies. Features p-n junction arrays optimized for forward voltage drop and surge current. HTS 8541.10.0040 covers these unmounted diode wafer forms.
Silicon Carbide Power Diode Die
Unmounted SiC Schottky diode dice for high-temperature, high-power applications in EV inverters and renewable energy systems. These 1200V-rated dice offer low switching losses compared to silicon. Classified in HTS 8541.10.0040 as unmounted chips/dice for non-LED diodes.
Germanium Point Contact Diode Chip
Unmounted germanium chips with whisker point-contact diodes for detector applications in microwave receivers and instrumentation. Known for low forward voltage and high-frequency response. HTS 8541.10.0040 includes such legacy semiconductor diode chips.
High Voltage Silicon Diode Wafer (1500V)
8-inch silicon wafers fabricated with 1500V breakdown planar diodes for X-ray generators and industrial power systems. Features field-limiting rings for high voltage reliability. Unmounted wafer form qualifies for HTS 8541.10.0040 diode classification.
RF Silicon Varactor Diode Die
Unmounted silicon hyperabrupt junction varactor diode dice for voltage-controlled oscillators and tuning circuits in wireless communications. Exhibits precise capacitance-voltage characteristics. HTS 8541.10.0040 covers these semiconductor variable capacitance diodes.