Multi-Wire Wafer Slicer
Diamond wire multi-slicer that simultaneously cuts hundreds of wafers from semiconductor boules, minimizing kerf loss. Classified HTS 8486.40.00, note 11(C)(ii)(B) wafer slicing equipment. Enables thin wafer production (50 microns).
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Import Tips & Compliance
• Specify wire diameter (60-120 microns) and simultaneous slice count
• Include slurry recirculation system documentation
• Validate thin wafer capability (<100 microns)
Related Products under HTS 8486.40.00
Czochralski Crystal Puller
A machine used to produce extremely pure monocrystalline semiconductor boules from molten silicon using the Czochralski method, from which wafers are sliced. It falls under HTS 8486.40.00 as apparatus specified in note 11(C) for semiconductor boule manufacturing. Essential for creating high-purity crystals in semiconductor production.
Float Zone Crystal Grower
Apparatus employing the float zone method to produce monocrystalline semiconductor boules without crucibles, ideal for high-purity silicon and gallium arsenide. Classified in HTS 8486.40.00 per note 11(C) for wafer precursor manufacturing. Critical for oxygen-free crystal production in advanced semiconductors.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters (e.g., 200mm, 300mm) and grinds orientation flats indicating conductivity type. Covered by HTS 8486.40.00 under note 11(C)(ii)(A) for wafer preparation. Ensures dimensional accuracy before slicing.
Semiconductor Wafer Slicing Saw
High-precision inner-diameter saw that slices ultra-thin wafers (25-775 microns) from monocrystalline semiconductor boules while minimizing subsurface damage. HTS 8486.40.00 per note 11(C)(ii)(B) for wafer manufacturing equipment. Uses diamond-impregnated blades optimized for silicon/gallium arsenide.
Wafer Edge Grinder
Machine that grinds wafer edges to precise chamfer profiles, preventing chipping during handling and processing. Specified in HTS 8486.40.00 under note 11(C) wafer preparation equipment. Critical for 300mm+ wafer handling in modern fabs.
Double-Sided Wafer Lapper
Simultaneous double-sided lapping machine that achieves wafer parallelism within 1 micron for semiconductor processing. HTS 8486.40.00 per note 11(C)(ii)(C) for wafer preparation. Uses cast iron plates with diamond slurry for silicon/gallium arsenide wafers.