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8486.40.00/Multi-Wire Wafer Slicer/Mexico

Multi-Wire Wafer Slicer from Mexico

Diamond wire multi-slicer that simultaneously cuts hundreds of wafers from semiconductor boules, minimizing kerf loss. Classified HTS 8486.40.00, note 11(C)(ii)(B) wafer slicing equipment. Enables thin wafer production (50 microns).

Duty Rate — Mexico → United States

0%

Rate breakdown

9903.05.860%Universal product exemption (U.S. note 52(b))
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Import Tips

• Specify wire diameter (60-120 microns) and simultaneous slice count

• Include slurry recirculation system documentation

• Validate thin wafer capability (<100 microns)

Multi-Wire Wafer Slicer from Mexico — Import Duty Rate | HTS 8486.40.00