Multi-Wire Wafer Slicer from Germany
Diamond wire multi-slicer that simultaneously cuts hundreds of wafers from semiconductor boules, minimizing kerf loss. Classified HTS 8486.40.00, note 11(C)(ii)(B) wafer slicing equipment. Enables thin wafer production (50 microns).
Duty Rate — Germany → United States
0%
Rate breakdown
9903.05.860%Universal product exemption (U.S. note 52(b))
Import Tips
• Specify wire diameter (60-120 microns) and simultaneous slice count
• Include slurry recirculation system documentation
• Validate thin wafer capability (<100 microns)