Multi-Wire Wafer Slicer from China
Diamond wire multi-slicer that simultaneously cuts hundreds of wafers from semiconductor boules, minimizing kerf loss. Classified HTS 8486.40.00, note 11(C)(ii)(B) wafer slicing equipment. Enables thin wafer production (50 microns).
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify wire diameter (60-120 microns) and simultaneous slice count
• Include slurry recirculation system documentation
• Validate thin wafer capability (<100 microns)