Multi-Wire Wafer Slicer from Canada
Diamond wire multi-slicer that simultaneously cuts hundreds of wafers from semiconductor boules, minimizing kerf loss. Classified HTS 8486.40.00, note 11(C)(ii)(B) wafer slicing equipment. Enables thin wafer production (50 microns).
Duty Rate — Canada → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify wire diameter (60-120 microns) and simultaneous slice count
• Include slurry recirculation system documentation
• Validate thin wafer capability (<100 microns)