Chip Mounter for IC Assembly Lines
High-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats. Classified in HTS 8486.40.0020 for assembling electronic integrated circuits with vision-guided placement accuracy under 10μm. Essential for surface-mount technology in semiconductor packaging.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general PCB surface-mount assembly
SMT mounters for consumer electronics, not dedicated semiconductor IC assembly.
If for testing semiconductor devices
Post-assembly test handlers classify separately from assembly equipment.
If bulk material handling configuration
If primarily for lifting/handling rather than precision mounting, other machinery chapter.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Specify chip size range (0201 to 50x50mm) and placement speed (>20k CPH) proving semiconductor capability
• Validate nitrogen-purged placement heads for oxidation-sensitive processes in documentation
Related Products under HTS 8486.40.00.20
Wire Bonding Machine for IC Packaging
Automated equipment that uses ultrasonic or thermosonic energy to attach gold or copper wires between semiconductor die pads and lead frame fingers. Classified under HTS 8486.40.0020 for its principal use in assembling electronic integrated circuits. Capable of ball, wedge, or stitch bonding with sub-micron precision.
Tape and Reel Encapsulator for Semiconductors
Machine that seals assembled semiconductor devices in embossed carrier tape for automated handling and shipping. Under HTS 8486.40.0020 as part of electronic integrated circuit assembly process, featuring cover tape sealing and vision inspection. Prevents contamination during high-volume IC production.
IC Lead Frame Stripper
Automated machine that separates singulated IC packages from continuous lead frames after assembly. Falls under HTS 8486.40.0020 as essential equipment for completing semiconductor device assembly. Features vision inspection to ensure defect-free separation.
Die Bonder Machine for Semiconductor Assembly
A precision machine that picks and places semiconductor dies onto lead frames or substrates using epoxy or eutectic bonding methods. It falls under HTS 8486.40.0020 as it is specifically designed for assembling semiconductor devices during electronic integrated circuit production. High-speed models handle thousands of dies per hour with micron-level accuracy.
Flip Chip Bonder for Semiconductor Devices
High-precision equipment that aligns and bonds flipped semiconductor dies to substrates using solder bumps or conductive adhesives. Falls under HTS 8486.40.0020 due to its specialized role in advanced IC packaging processes like 3D stacking. Features thermocompression and reflow capabilities for high-density interconnects.
Semiconductor Lid Attacher
Precision equipment that applies and seals metal or ceramic lids onto semiconductor packages using thermal compression or epoxy dispense. Classified HTS 8486.40.0020 for final assembly step in electronic integrated circuit hermetic packaging. Ensures reliability for automotive and aerospace ICs.