Chip Mounter for IC Assembly Lines from Germany

High-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats. Classified in HTS 8486.40.0020 for assembling electronic integrated circuits with vision-guided placement accuracy under 10μm. Essential for surface-mount technology in semiconductor packaging.

Duty Rate — Germany → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

Import Tips

Specify chip size range (0201 to 50x50mm) and placement speed (>20k CPH) proving semiconductor capability

Validate nitrogen-purged placement heads for oxidation-sensitive processes in documentation