Chip Mounter for IC Assembly Lines from Mexico
High-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats. Classified in HTS 8486.40.0020 for assembling electronic integrated circuits with vision-guided placement accuracy under 10μm. Essential for surface-mount technology in semiconductor packaging.
Duty Rate — Mexico → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Specify chip size range (0201 to 50x50mm) and placement speed (>20k CPH) proving semiconductor capability
• Validate nitrogen-purged placement heads for oxidation-sensitive processes in documentation