Chip Mounter for IC Assembly Lines from China
High-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats. Classified in HTS 8486.40.0020 for assembling electronic integrated circuits with vision-guided placement accuracy under 10μm. Essential for surface-mount technology in semiconductor packaging.
Duty Rate — China → United States
25%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify chip size range (0201 to 50x50mm) and placement speed (>20k CPH) proving semiconductor capability
• Validate nitrogen-purged placement heads for oxidation-sensitive processes in documentation