8486.40.00.20/Chip Mounter for IC Assembly Lines/Japan

Chip Mounter for IC Assembly Lines from Japan

High-speed pick-and-place machine optimized for mounting semiconductor chips onto substrates in reel-to-reel or tray formats. Classified in HTS 8486.40.0020 for assembling electronic integrated circuits with vision-guided placement accuracy under 10μm. Essential for surface-mount technology in semiconductor packaging.

Duty Rate — Japan → United States

0%

Rate breakdown

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Specify chip size range (0201 to 50x50mm) and placement speed (>20k CPH) proving semiconductor capability

• Validate nitrogen-purged placement heads for oxidation-sensitive processes in documentation