Semiconductor Lid Attacher
Precision equipment that applies and seals metal or ceramic lids onto semiconductor packages using thermal compression or epoxy dispense. Classified HTS 8486.40.0020 for final assembly step in electronic integrated circuit hermetic packaging. Ensures reliability for automotive and aerospace ICs.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general mechanical lid applicators
Non-hermetic semiconductor lid equipment falls under mechanical appliances.
If with dominant soldering function
Lid welders primarily for electrical connections classify in soldering machines.
If for flat panel display sealing
Display panel lid equipment under separate flat panel machinery provisions.
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Import Tips & Compliance
• Document lid materials (Kovar, alumina) and hermeticity test capabilities for classification
• Provide void-free bonding process specs (ASTM F19 leak testing) in technical files
Related Products under HTS 8486.40.00.20
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