Semiconductor Lid Attacher from Canada
Precision equipment that applies and seals metal or ceramic lids onto semiconductor packages using thermal compression or epoxy dispense. Classified HTS 8486.40.0020 for final assembly step in electronic integrated circuit hermetic packaging. Ensures reliability for automotive and aerospace ICs.
Duty Rate — Canada → United States
0%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Document lid materials (Kovar, alumina) and hermeticity test capabilities for classification
• Provide void-free bonding process specs (ASTM F19 leak testing) in technical files