Ultra-Precision Wafer Slicing Race
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness. HTS 8482.99.05.00 for ball bearing outer rings.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If sawing machine components
Wafer saws as stone/semi-conductor machines use Chapter 84.
If saw blade arbors
If functions primarily as blade mount rather than bearing.
If thickness measurement spindles
Precision gauging equipment for wafer slicing control.
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Import Tips & Compliance
• Include dynamic balance grades (G0.4) and saw blade interface specs
• Separate races from spindle assemblies for optimal classification
• Verify diamond blade runout compatibility in technical docs
Related Products under HTS 8482.99.05.00
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Precision-machined stainless steel inner ring designed specifically for ball bearings used in high-speed industrial applications. It forms the rotating inner component that works with balls and an outer race to reduce friction. Classified under HTS 8482.99.05.00 as an inner ring exclusively for ball bearings.
Chrome Steel Ball Bearing Outer Race
Hardened chrome steel outer ring or race for radial ball bearings, providing the stationary housing for bearing balls in automotive and machinery applications. Essential component machined to exact tolerances for smooth rotation. Falls under HTS 8482.99.05.00 as an outer race dedicated to ball bearings.
Ceramic Hybrid Ball Bearing Inner Ring
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Precision Ground Ball Bearing Raceway Ring
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Deep Groove Ball Bearing Outer Ring
Machined steel outer ring with deep ball path groove for radial load deep groove ball bearings in wafer slicing saw spindles. Provides primary load-bearing surface in high-precision cuts. Under HTS 8482.99.05.00 as outer race for ball bearings.