For ball bearings
Ball or roller bearings, and parts thereof: > Parts: > Other: > Inner or outer rings or races: > For ball bearings
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8482.99.05.00
Stainless Steel Ball Bearing Inner Race
Precision-machined stainless steel inner ring designed specifically for ball bearings used in high-speed industrial applications. It forms the rotating inner component that works with balls and an outer race to reduce friction. Classified under HTS 8482.99.05.00 as an inner ring exclusively for ball bearings.
Chrome Steel Ball Bearing Outer Race
Hardened chrome steel outer ring or race for radial ball bearings, providing the stationary housing for bearing balls in automotive and machinery applications. Essential component machined to exact tolerances for smooth rotation. Falls under HTS 8482.99.05.00 as an outer race dedicated to ball bearings.
Ceramic Hybrid Ball Bearing Inner Ring
High-precision inner race made from bearing-grade steel for hybrid ceramic ball bearings used in semiconductor wafer polishers. Optimized for ultra-low friction and high RPM in cleanroom environments. HTS 8482.99.05.00 applies to this inner ring part for ball bearings.
Precision Ground Ball Bearing Raceway Ring
Outer race with superfinished raceway surface (RMS 8-12 μin) for miniature ball bearings in semiconductor crystal pullers. Critical for maintaining wafer boule diameter precision during grinding processes. Classified as outer ring for ball bearings under HTS 8482.99.05.00.
ABEC-7 Precision Ball Bearing Inner Race
ABEC-7 tolerance inner race for instrument-grade ball bearings used in semiconductor wafer positioning systems. Features micro-polished raceways for vibration-free operation at 100,000+ RPM. HTS 8482.99.05.00 for ball bearing inner rings.
Deep Groove Ball Bearing Outer Ring
Machined steel outer ring with deep ball path groove for radial load deep groove ball bearings in wafer slicing saw spindles. Provides primary load-bearing surface in high-precision cuts. Under HTS 8482.99.05.00 as outer race for ball bearings.
Miniature Ball Bearing Race Set
Matched inner and outer races (ID 1.5mm) for miniature ball bearings in semiconductor probe cards and handlers. Super-lapped for sub-micron tolerances required in wafer testing. Both rings classified under HTS 8482.99.05.00 for ball bearings.
High-Temperature Ball Bearing Inner Race
Inconel alloy inner race for ball bearings operating at 1000°F+ in semiconductor diffusion furnaces. Retains hardness and dimensional stability under thermal cycling. HTS 8482.99.05.00 as inner ring for specialized ball bearings.
Wafer Grinder Spindle Ball Bearing Race
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention. Specifically HTS 8482.99.05.00 for ball bearing outer rings.
Crystal Puller Bearing Outer Ring
Heavy-duty outer race for ball bearings rotating crystal boules in Czochralski semiconductor pullers. Designed for 500kg+ loads at low speeds with melt containment. HTS 8482.99.05.00 classification for ball bearing parts.
Silicon Carbide Coated Ball Bearing Race
Inner race with SiC plasma coating for particle-free operation in semiconductor lapping equipment. Extends life 5x over uncoated steel in slurry environments. Remains HTS 8482.99.05.00 as base steel ring for ball bearings.
Ultra-Precision Wafer Slicing Race
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness. HTS 8482.99.05.00 for ball bearing outer rings.
Monocrystalline Silicon Bearing Race
Non-magnetic silicon inner race for ball bearings in MRI-grade semiconductor handlers. Matches thermal expansion of silicon wafers for zero-stress mounting. Still HTS 8482.99.05.00 as semiconductor-processed ring for ball bearings.
Float Zone Crystal Bearing Inner Ring
Float zone purified silicon inner ring for vacuum ball bearings in zone refining equipment. Ultra-low oxygen content prevents contamination in GaAs crystal growth. HTS 8482.99.05.00 for specialized ball bearing inner rings.
Gallium Arsenide Wafer Polisher Race
Titanium outer race for chemically inert ball bearings polishing GaAs wafers to atomic flatness. Resists CMP slurry corrosion during 0.5μm/min removal rates. HTS 8482.99.05.00 as outer ring for ball bearings in semiconductor processing.