Stainless Steel Ball Bearing Inner Race
Precision-machined stainless steel inner ring designed specifically for ball bearings used in high-speed industrial applications. It forms the rotating inner component that works with balls and an outer race to reduce friction. Classified under HTS 8482.99.05.00 as an inner ring exclusively for ball bearings.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If integrated into semiconductor wafer grinders
Parts of specialized semiconductor processing machines may classify in Chapter 84 under end-use provisions.
If for precision testing apparatus in semiconductor fabs
Parts of metrology equipment for wafer flatness testing fall under Chapter 90 optical/precision instruments.
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Import Tips & Compliance
• Verify material certification (e.g
• AISI 440C stainless) and dimensional specs match ball bearing standards to avoid reclassification
• Include engineering drawings and end-use statements proving compatibility with ball bearings, especially for semiconductor wafer handling equipment
• Watch for anti-dumping duties on Chinese-origin bearing parts; request scope rulings if used in cleanroom applications
Related Products under HTS 8482.99.05.00
Chrome Steel Ball Bearing Outer Race
Hardened chrome steel outer ring or race for radial ball bearings, providing the stationary housing for bearing balls in automotive and machinery applications. Essential component machined to exact tolerances for smooth rotation. Falls under HTS 8482.99.05.00 as an outer race dedicated to ball bearings.
Ceramic Hybrid Ball Bearing Inner Ring
High-precision inner race made from bearing-grade steel for hybrid ceramic ball bearings used in semiconductor wafer polishers. Optimized for ultra-low friction and high RPM in cleanroom environments. HTS 8482.99.05.00 applies to this inner ring part for ball bearings.
Precision Ground Ball Bearing Raceway Ring
Outer race with superfinished raceway surface (RMS 8-12 μin) for miniature ball bearings in semiconductor crystal pullers. Critical for maintaining wafer boule diameter precision during grinding processes. Classified as outer ring for ball bearings under HTS 8482.99.05.00.
ABEC-7 Precision Ball Bearing Inner Race
ABEC-7 tolerance inner race for instrument-grade ball bearings used in semiconductor wafer positioning systems. Features micro-polished raceways for vibration-free operation at 100,000+ RPM. HTS 8482.99.05.00 for ball bearing inner rings.
Deep Groove Ball Bearing Outer Ring
Machined steel outer ring with deep ball path groove for radial load deep groove ball bearings in wafer slicing saw spindles. Provides primary load-bearing surface in high-precision cuts. Under HTS 8482.99.05.00 as outer race for ball bearings.
Miniature Ball Bearing Race Set
Matched inner and outer races (ID 1.5mm) for miniature ball bearings in semiconductor probe cards and handlers. Super-lapped for sub-micron tolerances required in wafer testing. Both rings classified under HTS 8482.99.05.00 for ball bearings.