Monocrystalline Silicon Bearing Race
Non-magnetic silicon inner race for ball bearings in MRI-grade semiconductor handlers. Matches thermal expansion of silicon wafers for zero-stress mounting. Still HTS 8482.99.05.00 as semiconductor-processed ring for ball bearings.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If unwrought silicon forms
Raw semiconductor silicon ingots classify as chemical elements.
If finished semiconductor devices
If incorporates doping/junctions, becomes Chapter 85 device.
If other machined silicon shapes
Non-bearing semiconductor components use plastics/miscellaneous.
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Import Tips & Compliance
• Provide resistivity and crystal orientation specs (100-plane) linking to wafer handling
• Classify as fabricated silicon article shaped for bearings, not raw material
• Declare CTE matching (2.6 ppm/°C) as key design feature
Related Products under HTS 8482.99.05.00
Stainless Steel Ball Bearing Inner Race
Precision-machined stainless steel inner ring designed specifically for ball bearings used in high-speed industrial applications. It forms the rotating inner component that works with balls and an outer race to reduce friction. Classified under HTS 8482.99.05.00 as an inner ring exclusively for ball bearings.
Chrome Steel Ball Bearing Outer Race
Hardened chrome steel outer ring or race for radial ball bearings, providing the stationary housing for bearing balls in automotive and machinery applications. Essential component machined to exact tolerances for smooth rotation. Falls under HTS 8482.99.05.00 as an outer race dedicated to ball bearings.
Ceramic Hybrid Ball Bearing Inner Ring
High-precision inner race made from bearing-grade steel for hybrid ceramic ball bearings used in semiconductor wafer polishers. Optimized for ultra-low friction and high RPM in cleanroom environments. HTS 8482.99.05.00 applies to this inner ring part for ball bearings.
Precision Ground Ball Bearing Raceway Ring
Outer race with superfinished raceway surface (RMS 8-12 μin) for miniature ball bearings in semiconductor crystal pullers. Critical for maintaining wafer boule diameter precision during grinding processes. Classified as outer ring for ball bearings under HTS 8482.99.05.00.
ABEC-7 Precision Ball Bearing Inner Race
ABEC-7 tolerance inner race for instrument-grade ball bearings used in semiconductor wafer positioning systems. Features micro-polished raceways for vibration-free operation at 100,000+ RPM. HTS 8482.99.05.00 for ball bearing inner rings.
Deep Groove Ball Bearing Outer Ring
Machined steel outer ring with deep ball path groove for radial load deep groove ball bearings in wafer slicing saw spindles. Provides primary load-bearing surface in high-precision cuts. Under HTS 8482.99.05.00 as outer race for ball bearings.