Ultra-Precision Wafer Slicing Race from Mexico
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness. HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — Mexico → United States
34.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Include dynamic balance grades (G0.4) and saw blade interface specs
• Separate races from spindle assemblies for optimal classification
• Verify diamond blade runout compatibility in technical docs