Ultra-Precision Wafer Slicing Race from China
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness. HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — China → United States
44.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include dynamic balance grades (G0.4) and saw blade interface specs
• Separate races from spindle assemblies for optimal classification
• Verify diamond blade runout compatibility in technical docs