Ultra-Precision Wafer Slicing Race from Japan
Outer race for 80,000 RPM ball bearings in inner-diameter wafer slicing saws producing 25μm kerf cuts. Runout <0.15μm ensures uniform silicon wafer thickness. HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — Japan → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include dynamic balance grades (G0.4) and saw blade interface specs
• Separate races from spindle assemblies for optimal classification
• Verify diamond blade runout compatibility in technical docs