Float Zone Crystal Furnace
Equipment employing the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible. Classified in HTS 8479.90.95 as other semiconductor manufacturing machinery having individual functions. Used primarily for high-resistivity silicon wafers.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If classified primarily by induction heating function
Focus on RF generator might lead to Chapter 85 classification for industrial heating equipment.
If for gallium arsenide processing variants
Compound semiconductor versions may fall under specific statistical provisions.
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Import Tips & Compliance
• Include process flow diagrams showing float zone method to confirm semiconductor-specific use
• Labeling must specify polycrystalline rod feedstock and RF heating system components
Related Products under HTS 8479.90.95
Crystal Boule Grinder
Machine that grinds semiconductor crystal boules to precise diameter and adds flats indicating conductivity type and resistivity. Meets HTS 8479.90.95 as wafer preparation equipment per statistical note. Essential step before wafer slicing in semiconductor production.
Double-Sided Wafer Polisher
Machine simultaneously polishing both sides of semiconductor wafers to mirror finish using chemical-mechanical planarization (CMP). HTS 8479.90.95 for wafer preparation polishers in statistical note. Achieves nanometer-level surface flatness.
Silicon Ingot Grinder
Precision grinder for shaping silicon ingots to exact diameter prior to wafer slicing in semiconductor production. Classified HTS 8479.90.95 as crystal grinder per statistical note. Handles 200mm-450mm diameter ingots.
Wafer Edge Profiling Machine
Equipment that profiles wafer edges to prevent chipping and contamination during handling. HTS 8479.90.95 as specialized wafer preparation apparatus. Applies rounded bevels meeting SEMI standards.
Crystal boule Annealing Furnace
High-temperature furnace for annealing semiconductor boules to relieve stresses post-growth. Classified under HTS 8479.90.95 as semiconductor processing equipment. Provides controlled cooling rates to prevent defects.
Wafer Cleaning Centrifuge
High-speed centrifuge removing contaminants from semiconductor wafers post-polishing via centrifugal force. HTS 8479.90.95 for wafer preparation equipment. Handles 25-50 wafers per cycle.