Wafer Lapping Machine
Machine that lap-grinds semiconductor wafers to precise flatness and thickness tolerances before fabrication. Classified HTS 8479.89.95 under wafer preparation grinders, lappers, and polishers for semiconductor processing.
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More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general lapping/polishing machines
Not specialized for semiconductor wafer dimensional tolerances.
If integrated with testing functions
Testing apparatus for wafers moves to Chapter 90.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Provide flatness specification data (e.g
• <1 micron); common error is ignoring embedded metrology tools
• Use HTS advisory opinions
Related Products under HTS 8479.89.95
Conductivity Flat Grinder
Machine grinding precise flats on semiconductor boules to encode conductivity type and resistivity data. Specific to HTS 8479.89.95 crystal grinding equipment.
Automated Wafer Edge Grinder
Robotic edge grinding machine preventing wafer chipping during handling in fabs. HTS 8479.89.95 wafer grinder category.
High-Flatness Wafer Lapper
Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.
CMP Wafer Polishing Station
Complete chemical mechanical polishing station for wafer planarization. Full HTS 8479.89.95 semiconductor polisher coverage.
Silicon Ingot Grinder
Grinding machine for semiconductor silicon ingots to precise diameters with orientation flats for wafer slicing. Falls in HTS 8479.89.95 as crystal grinders per statistical notes on wafer manufacturing equipment.
Gallium Arsenide Wafer Slicer
Specialized saw for slicing fragile GaAs wafers from compound semiconductor boules. HTS 8479.89.95 includes such wafer slicing equipment for materials like gallium arsenide per official notes.