Wafer Lapping Machine
Machine that lap-grinds semiconductor wafers to precise flatness and thickness tolerances before fabrication. Classified HTS 8479.89.95 under wafer preparation grinders, lappers, and polishers for semiconductor processing.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general lapping/polishing machines
Not specialized for semiconductor wafer dimensional tolerances.
If integrated with testing functions
Testing apparatus for wafers moves to Chapter 90.
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Import Tips & Compliance
• Provide flatness specification data (e.g
• <1 micron); common error is ignoring embedded metrology tools
• Use HTS advisory opinions
Related Products under HTS 8479.89.95
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