Ultrasonic cleaning devices
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and mechanical appliances: > Other: > Other > Ultrasonic cleaning devices
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8479.89.95.85
Crest Ultrasonics Benchtop Cleaner
A compact ultrasonic cleaning device designed for precision cleaning of small parts in semiconductor wafer preparation, using high-frequency sound waves to remove contaminants without physical contact. It falls under HTS 8479.89.95.85 as an ultrasonic cleaning machine specialized for semiconductor manufacturing processes like post-grinding wafer cleanup. This equipment ensures wafers meet flatness tolerances critical for fabrication.
Semix Ultrasonic Crystal Grinder Cleaner
Post-grinding ultrasonic cleaner for semiconductor crystal boules, ensuring flats indicate conductivity without surface damage. Under HTS 8479.89.95.85 per notes for crystal grinder adjuncts in wafer manufacturing. Prepares boules for precise slicing.
Velonix Wafer Ultrasonic Cleaner
Industrial ultrasonic cleaning system for semiconductor wafers post-slicing, featuring megasonic transducers for sub-micron particle removal. Classified under HTS 8479.89.95.85 for its role in wafer preparation equipment within semiconductor processing. It prepares surfaces to exact flatness specs before fabrication.
Aquanomics Megasonic Wafer Tank
Megasonic ultrasonic cleaning station for lapping and polishing semiconductor wafers, removing residues to achieve mirror-flat surfaces. It qualifies for HTS 8479.89.95.85 as specialized apparatus in the statistical note for wafer preparation equipment. Critical for dimensional tolerances in chip fabrication.
PureTech Inline Wafer Ultrasonic Bath
Inline ultrasonic cleaning bath for high-volume semiconductor wafer processing after lapping, maintaining throughput in fab lines. Fits HTS 8479.89.95.85 as processing equipment for semiconductor materials per chapter notes. Achieves critical surface flatness for device fabrication.
Lambda Precision Ultrasonic Polisher Cleaner
Ultrasonic rinse station following wafer polishers, specialized for monocrystalline silicon wafers in semiconductor production. Classified in HTS 8479.89.95.85 for wafer preparation grinders, lappers, and polishers support equipment. Ensures haze-free surfaces for lithography.