Crest Ultrasonics Benchtop Cleaner
A compact ultrasonic cleaning device designed for precision cleaning of small parts in semiconductor wafer preparation, using high-frequency sound waves to remove contaminants without physical contact. It falls under HTS 8479.89.95.85 as an ultrasonic cleaning machine specialized for semiconductor manufacturing processes like post-grinding wafer cleanup. This equipment ensures wafers meet flatness tolerances critical for fabrication.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for general laboratory or jewelry cleaning use
Non-specialized ultrasonic cleaners for labs or jewelry fall under other machinery, not semiconductor-specific provisions.
If classified primarily as testing apparatus
Equipment focused on wafer testing rather than cleaning processing moves to Chapter 90 instruments.
If imported as a complete cleanroom assembly set
Machines for semiconductor manufacture in sets are classified under dedicated semiconductor provisions.
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Import Tips & Compliance
• Verify cleanroom compatibility certification (ISO 14644) to meet semiconductor import standards and avoid reclassification
• Include detailed technical specs showing ultrasonic frequency (e.g
• 40-80 kHz) for wafer processing in customs documentation
• Beware of dual-use claims; pure lab cleaners may shift to 8479.89.65 if not proven for semiconductor production
Related Products under HTS 8479.89.95.85
Semix Ultrasonic Crystal Grinder Cleaner
Post-grinding ultrasonic cleaner for semiconductor crystal boules, ensuring flats indicate conductivity without surface damage. Under HTS 8479.89.95.85 per notes for crystal grinder adjuncts in wafer manufacturing. Prepares boules for precise slicing.
Velonix Wafer Ultrasonic Cleaner
Industrial ultrasonic cleaning system for semiconductor wafers post-slicing, featuring megasonic transducers for sub-micron particle removal. Classified under HTS 8479.89.95.85 for its role in wafer preparation equipment within semiconductor processing. It prepares surfaces to exact flatness specs before fabrication.
Aquanomics Megasonic Wafer Tank
Megasonic ultrasonic cleaning station for lapping and polishing semiconductor wafers, removing residues to achieve mirror-flat surfaces. It qualifies for HTS 8479.89.95.85 as specialized apparatus in the statistical note for wafer preparation equipment. Critical for dimensional tolerances in chip fabrication.
PureTech Inline Wafer Ultrasonic Bath
Inline ultrasonic cleaning bath for high-volume semiconductor wafer processing after lapping, maintaining throughput in fab lines. Fits HTS 8479.89.95.85 as processing equipment for semiconductor materials per chapter notes. Achieves critical surface flatness for device fabrication.
Lambda Precision Ultrasonic Polisher Cleaner
Ultrasonic rinse station following wafer polishers, specialized for monocrystalline silicon wafers in semiconductor production. Classified in HTS 8479.89.95.85 for wafer preparation grinders, lappers, and polishers support equipment. Ensures haze-free surfaces for lithography.