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High-Flatness Wafer Lapper

Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³China2.5%+37.5%40%
πŸ‡²πŸ‡½Mexico2.5%+10.0%12.5%
πŸ‡¨πŸ‡¦Canada2.5%+10.0%12.5%
πŸ‡©πŸ‡ͺGermanyFree+10.0%10%
πŸ‡―πŸ‡΅JapanFree+12.5%12.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.39.00Higher: 41.9% vs 40%

If precision surface grinding

General vs semiconductor flatness specs.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Flatness measurement validation required