Other
Machines and mechanical appliances having individual functions, not specified or included elsewhere in this chapter; parts thereof: > Other machines and mechanical appliances: > Other: > Other > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8479.89.95.99
Semiconductor Wafer Lapper
Machine that lap-grinds both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness. Classified under HTS 8479.89.95.99 as wafer preparation equipment per statistical note (a)(ii)(C). Prepares wafers for final polishing and fabrication.
Gallium Arsenide Wafer Slicer
Specialized saw for slicing fragile gallium arsenide wafers from boules, using wire or blade tech optimized for compound semiconductors. HTS 8479.89.95.99 per statistical notes covering GaAs processing. Prevents cracking in brittle III-V materials.
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski method. It is classified under HTS 8479.89.95.99 as semiconductor manufacturing equipment for growing semiconductor materials, not specified elsewhere in Chapter 84. Essential for wafer production in semiconductor fabrication.
Float Zone Crystal Grower
Equipment employing the float zone method to purify and grow monocrystalline semiconductor boules by melting a narrow zone of polycrystalline rod with RF heating. Falls under HTS 8479.89.95.99 for wafer manufacturing in semiconductor processing. Used for high-purity silicon without crucible contamination.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8479.89.95.99 as wafer preparation equipment per statistical notes. Critical step before slicing in semiconductor fabrication.
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8479.89.95.99 applies to this wafer preparation equipment as defined in statistical notes. Maintains crystal orientation during kerfless cutting.
Double-Sided Wafer Polisher
Automated polisher using chemical-mechanical planarization to achieve mirror-finish flatness on both wafer surfaces for semiconductor device fabrication. HTS 8479.89.95.99 for wafer preparation polishers per statistical notes. Removes subsurface damage from lapping.
Silicon Ingot Grinder
Precision grinder for shaping silicon ingots to exact diameters with orientation notches before wafer slicing in semiconductor production. Falls under HTS 8479.89.95.99 as crystal boule grinder per statistical note (a)(ii)(A). Ensures consistent wafer quality.