High-Flatness Wafer Lapper from Germany
Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Flatness measurement validation required