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High-Flatness Wafer Lapper from Mexico

Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.

Duty Rate — Mexico → United States

12.5%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter

Import Tips

Flatness measurement validation required