8479.89.95/High-Flatness Wafer Lapper/China

High-Flatness Wafer Lapper from China

Lapping equipment achieving sub-micron wafer bow/warp for advanced nodes. Statistical note compliant for HTS 8479.89.95.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Calculate with your customs valueVerify classification with AI

Import Tips

• Flatness measurement validation required

High-Flatness Wafer Lapper from China — Import Duty Rate | HTS 8479.89.95